Guangdong Zhongshi Metal Co., LTD.

Solder Bar

We produce various tin-lead and lead-free solder bars. Our solder bars are processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. Our technique results in stable, pure, low-drossing solder bars with good fluidity and wettability that increase throughput and decrease defects and cost.

· High reliability, low voidage

· Strong weldability: It can meet the difficult needs of some important lead-free devices, such as CSP, QFN, etc. Suitable for all kinds of lead-free circuit board surface coating, including: OSP, HASL, ENIG

· Excellent printability and printing life: stable and consistent printing performance of more than 12 hours, printing speed up to 150mm/s, short printing cycle, high output

· Wide reflux temperature curve process window: In air and nitrogen environments, good welding results can be achieved for complex high-density PWB components

· Excellent appearance of solder joints and residues after reflow soldering

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Products

Products DETAILS

Solder Bar

Product Application

Printed circuit board (PCB) assembly, including smartphones, tablets, computer motherboards, consumer electronics, web servers, automotive electronic systems, medical, military and aerospace equipment.